Magnetic sensor, signal processing circuit, and magnetic sensor device

ABSTRACT

A magnetic sensor includes at least one sensor main body; a detection circuit provided on the at least one sensor main body, the detection circuit including a magnetic detection element; and a plurality of sensor terminals provided on the at least one sensor main body. The plurality of sensor terminals include a plurality of signal terminals and a plurality of power supply terminals. The plurality of signal terminals are all disposed on a side of one end of the at least one sensor main body. The plurality of power supply terminals include at least one first terminal disposed on the side of the one end of the at least one sensor main body, and a plurality of second terminals disposed on a side of another end of the at least one sensor main body.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication No. 63/246,441 filed on Sep. 21, 2021, the entire contentswhich are incorporated herein by their reference.

BACKGROUND

The technology relates to a magnetic sensor including magnetic detectionelements, a signal processing circuit for a magnetic sensor, and amagnetic sensor device including a magnetic sensor and a signalprocessing circuit.

Magnetic sensor devices using magnetoresistive elements have been usedfor various applications in recent years. The magnetic sensor deviceincludes a magnetic sensor and a signal processing circuit. The magneticsensor is configured to detect a magnetic field as a detection targetand generate at least one detection signal. The signal processingcircuit is configured to perform predetermined signal processing on theat least one detection signal and generate a detection value having acorrespondence with the magnetic field as the detection target.

U.S. Patent Application Publication No. 2020/0116801 A1 discloses amagnetic sensor device that includes a sensor chip including magneticsensors and a circuit chip including a processor. In the magnetic sensordevice, the sensor chip is mounted on a top surface of the circuit chip.Each of a top surface of the sensor chip and the top surface of thecircuit chip is provided with a terminal group. The terminal group ofthe sensor chip is connected to the terminal group of the circuit chipby a plurality of bonding wires, for example.

The processor includes a signal processing circuit and a power supplycircuit. In a typical processor, a signal processing circuit isconfigured as one independent block and a power supply circuit isconfigured as another independent block so that mutual interferencebetween the signal processing circuit and the power supply circuit issuppressed.

The terminal group of the sensor chip includes a plurality of terminalsfor the magnetic sensors and a plurality of power supply terminals. In acase where the plurality of terminals for the magnetic sensors arecollectively disposed and the plurality of power supply terminals arealso collectively disposed in conformity with the processor, it has beennecessary to increase the dimension of the sensor chip if the number ofthe plurality of terminals for the magnetic sensors and the number ofthe plurality of power supply terminals are not equal.

SUMMARY

A magnetic sensor according to one embodiment of the technology includesat least one sensor main body; a detection circuit provided on the atleast one sensor main body, the detection circuit including a magneticdetection element; and a plurality of sensor terminals provided on theat least one sensor main body. The plurality of sensor terminals includea plurality of signal terminals and a plurality of power supplyterminals. The plurality of signal terminals are all disposed on a sideof one end of the at least one sensor main body. The plurality of powersupply terminals include at least one first terminal disposed on theside of the one end of the at least one sensor main body, and aplurality of second terminals disposed on a side of another end of theat least one sensor main body.

In the magnetic sensor according to one embodiment of the technology,the plurality of power supply terminals include at least one firstterminal and a plurality of second terminals disposed as describedabove. Thereby according to one embodiment of the technology, a magneticsensor with a compact size can be implemented.

A signal processing circuit according to one embodiment of thetechnology is a signal processing circuit for a magnetic sensor. Thesignal processing circuit includes a circuit main body; a first blockprovided on the circuit main body, the first block being configured toprocess a detection signal of the magnetic sensor; a second blockprovided on the circuit main body, the second block being configured tosupply power to the magnetic sensor; and a plurality of circuitterminals provided on the circuit main body. The plurality of circuitterminals include a plurality of signal terminals and a plurality ofpower supply terminals. The plurality of signal terminals are alldisposed on a side of one end of the circuit main body. The plurality ofpower supply terminals include at least one first terminal disposed onthe side of the one end of the circuit main body, and a plurality ofsecond terminals disposed on a side of another end of the circuit mainbody.

In the signal processing circuit according to one embodiment of thetechnology, the plurality of power supply terminals include at least onefirst terminal and a plurality of second terminals disposed as describedabove. Thereby according to one embodiment of the technology, a magneticsensor with a compact size can be used.

A magnetic sensor device according to one embodiment of the technologyincludes a magnetic sensor and a signal processing circuit for themagnetic sensor. The magnetic sensor includes at least one sensor mainbody, a detection circuit provided on the at least one sensor main body,the detection circuit including a magnetic detection element, and aplurality of sensor terminals provided on the at least one sensor mainbody. The plurality of sensor terminals include a plurality of firstsignal terminals and a plurality of first power supply terminals. Theplurality of first signal terminals are all disposed on a side of oneend of the at least one sensor main body. The plurality of first powersupply terminals include at least one first terminal disposed on theside of the one end of the at least one sensor main body, and aplurality of second terminals disposed on a side of another end of theat least one sensor main body.

The signal processing circuit includes a circuit main body, a firstblock provided on the circuit main body, the first block beingconfigured to process a detection signal of the magnetic sensor, asecond block provided on the circuit main body, the second block beingconfigured to supply power to the magnetic sensor, and a plurality ofcircuit terminals provided on the circuit main body. The plurality ofcircuit terminals include a plurality of second signal terminalsrespectively electrically connected to the plurality of first signalterminals, and a plurality of second power supply terminals respectivelyelectrically connected to the plurality of first power supply terminals.The plurality of second signal terminals are all disposed on a side ofone end of the circuit main body. The plurality of second power supplyterminals include at least one third terminal disposed on the side ofthe one end of the circuit main body, and a plurality of fourthterminals disposed on a side of another end of the circuit main body.

In the magnetic sensor device according to one embodiment of thetechnology, the plurality of first power supply terminals include atleast one first terminal and a plurality of second terminals disposed asdescribed above, and the plurality of second power supply terminalsinclude at least one third terminal and a plurality of fourth terminalsdisposed as described above. Thereby according to one embodiment of thetechnology, a magnetic sensor device including a magnetic sensor with acompact size can be implemented.

Other and further objects, features and advantages of the technologywill appear more fully from the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this specification. The drawings illustrate example embodimentsand, together with the specification, serve to explain the principles ofthe technology.

FIG. 1 is a perspective view showing a magnetic sensor device accordingto an example embodiment of the technology.

FIG. 2 is a side view showing the magnetic sensor device according tothe example embodiment of the technology.

FIG. 3 is a functional block diagram showing a configuration of themagnetic sensor device according to the example embodiment of thetechnology.

FIG. 4 is a circuit diagram showing a circuit configuration of a firstdetection circuit of the example embodiment of the technology.

FIG. 5 is a circuit diagram showing a circuit configuration of a seconddetection circuit of the example embodiment of the technology.

FIG. 6 is a circuit diagram showing a circuit configuration of a thirddetection circuit of the example embodiment of the technology.

FIG. 7 is a plan view showing a part of a first chip of the exampleembodiment of the technology.

FIG. 8 is a sectional view showing a part of the first chip of theexample embodiment of the technology.

FIG. 9 is a plan view showing a part of a second chip of the exampleembodiment of the technology.

FIG. 10 is a sectional view showing a part of the second chip of theexample embodiment of the technology.

FIG. 11 is a side view showing a magnetoresistive element of the exampleembodiment of the technology.

FIG. 12 is a plan view showing the magnetic sensor device according tothe example embodiment of the technology.

FIG. 13 is a plan view showing arrangement of a plurality of blocks in asignal processing circuit according to the example embodiment of thetechnology.

FIG. 14 is a plan view showing a modification example of the magneticsensor device according to the example embodiment of the technology.

DETAILED DESCRIPTION

An object of the technology is to provide a magnetic sensor with acompact size, a signal processing circuit, and a magnetic sensor device.

In the following, some example embodiments and modification examples ofthe technology are described in detail with reference to theaccompanying drawings. Note that the following description is directedto illustrative examples of the disclosure and not to be construed aslimiting the technology. Factors including, without limitation,numerical values, shapes, materials, components, positions of thecomponents, and how the components are coupled to each other areillustrative only and not to be construed as limiting the technology.Further, elements in the following example embodiments which are notrecited in a most-generic independent claim of the disclosure areoptional and may be provided on an as-needed basis. The drawings areschematic and are not intended to be drawn to scale. Like elements aredenoted with the same reference numerals to avoid redundantdescriptions. Note that the description is given in the following order.

First, a configuration of a magnetic sensor device including a magneticsensor according to an example embodiment of the technology will bedescribed with reference to FIGS. 1 to 3 . FIG. 1 is a perspective viewshowing a magnetic sensor device 100. FIG. 2 is a side view showing themagnetic sensor device 100. FIG. 3 is a functional block diagram showinga configuration of the magnetic sensor device 100.

The magnetic sensor device 100 includes a magnetic sensor 1 according tothe present example embodiment. The magnetic sensor 1 includes at leastone sensor main body. The at least one sensor main body is in the formof a chip, for example. In particular, in the present exampleembodiment, the at least one sensor main body includes a first chip 2and a second chip 2. The first chip 2 corresponds to a “first sensormain body” of the technology. The second chip 3 corresponds to a “secondsensor main body” of the technology. Components of the first chip 2 arealso components of the first sensor main body. Components of the secondchip 3 are also components of the second sensor main body.

The magnetic sensor device 100 further includes a signal processingcircuit 14 for the magnetic sensor 1. The signal processing circuit 14includes a circuit main body 4. The circuit main body 4 is used as asupport for supporting the first and second chips 2 and 3. The firstchip 2, the second chip 3, and the circuit main body 4 each have arectangular solid shape. The circuit main body 4 has a reference plane 4a that is a top surface, a bottom surface located opposite to thereference plane 4 a, and four side surfaces connecting the referenceplane 4 a and the bottom surface 4 b.

Now, a description will be given of a reference coordinate system in thepresent example embodiment with reference to FIGS. 1 and 2 . Thereference coordinate system is an orthogonal coordinate system that isset with reference to the magnetic sensor device 100 and defined bythree axes. An X direction, a Y direction, and a Z direction are definedin the reference coordinate system. The X, Y, and Z directions areorthogonal to each other. In particular, in the present exampleembodiment, a direction that is perpendicular to the reference plane 4 aof the circuit main body 4 and directed from the bottom surface 4 b ofthe circuit main body 4 to the reference plane 4 a is referred to as theZ direction. The opposite directions to the X, Y, and Z directions willbe expressed as −X, −Y, and −Z directions, respectively. The three axesdefining the reference coordinate system are an axis parallel to the Xdirection, an axis parallel to the Y direction, and an axis parallel tothe Z direction.

Hereinafter, the term “above” refers to positions located forward of areference position in the Z direction, and “below” refers to positionsopposite from the “above” positions with respect to the referenceposition. For each component of the magnetic sensor device 100, the term“top surface” refers to a surface of the component located at the endthereof in the Z direction, and “bottom surface” refers to a surface ofthe component located at the end thereof in the −Z direction. Theexpression “when seen in the Z direction” means that the intended objectis seen from a position at a distance in the Z direction.

The first chip 2 has a top surface 2 a and a bottom surface 2 b that arelocated opposite to each other, and four side surfaces connecting thetop surface 2 a and the bottom surface 2 b. The second chip 3 has a topsurface 3 a and a bottom surface 3 b that are located opposite to eachother, and four side surfaces connecting the top surface 3 a and thebottom surface 3 b.

The first chip 2 is mounted on the reference plane 4 a in a posture suchthat the bottom surface 2 b of the first chip 2 faces the referenceplane 4 a of the circuit main body 4. The second chip 3 is mounted onthe reference plane 4 a in a posture such that the bottom surface 3 b ofthe second chip 3 faces the reference plane 4 a of the circuit main body4. The first chip 2 and the second chip 3 are bonded to the circuit mainbody 4 with, for example, adhesives 6 and 7, respectively.

The magnetic sensor 1 includes a first detection circuit 10, a seconddetection circuit 20, and a third detection circuit 30. The firstdetection circuit 10 is provided on the first chip 2. The seconddetection circuit 20 and the third detection circuit 30 are provided onthe second chip 3.

The first to third detection circuits 10, 20, and 30 each include aplurality of magnetic detection elements, and are configured to detect atarget magnetic field and generate at least one detection signal. Inparticular, in the example embodiment, the plurality of magneticdetection elements are a plurality of magnetoresistive elements. Themagnetoresistive elements will hereinafter be referred to as MRelements.

The signal processing circuit 14 includes a processor 40 provided in thecircuit main body 4. The processor 40 is a main part of the signalprocessing circuit 14. The processor 40 is configured to generate afirst detection value, a second detection value, and a third detectionvalue by processing the plurality of detection signals generated by thefirst to third detection circuits 10, 20, and 30. The first, second, andthird detection values have a correspondence with components of themagnetic field in three respective different directions at apredetermined reference position. In particular, in the present exampleembodiment, the foregoing three different directions are two directionsparallel to an XY plane and a direction parallel to the Z direction. Forexample, the processor 40 is constructed of an application-specificintegrated circuit (ASIC).

The first to third detection circuits 10, 20, and 30 and the processor40 are connected via a plurality of bonding wires. The connectionbetween the first to third detection circuits 10, 20, and 30 and theprocessor 40 will be described in detail later.

The magnetic sensor device 100 may be mounted on a printed board 5, forexample. In such a case, the magnetic sensor device 100 is mounted on atop surface of the printed board 5 in such a posture that the bottomsurface 4 b of the circuit main body 4 faces the top surface of theprinted board 5. The circuit main body 4 is bonded to the printed board5 with, for example, an adhesive 8. The magnetic sensor device 100mounted on the printed board 5 is sealed with a not-shown molded resin.

Next, the first to third detection circuits 10, 20, and 30 will bedescribed with reference to FIGS. 3 to 10 . FIG. 4 is a circuit diagramshowing a circuit configuration of the first detection circuit 10. FIG.5 is a circuit diagram showing a circuit configuration of the seconddetection circuit 20. FIG. 6 is a circuit diagram showing a circuitconfiguration of the third detection circuit 30. FIG. 7 is a plan viewshowing a part of the first chip 2. FIG. 8 is a sectional view showing apart of the first chip 2. FIG. 9 is a plan view showing a part of thesecond chip 3. FIG. 10 is a sectional view showing a part of the secondchip 3.

Here, as shown in FIGS. 7 and 9 , a U direction and a V direction aredefined as follows. The U direction is a direction rotated from the Xdirection to the −Y direction. The V direction is a direction rotatedfrom the Y direction to the X direction. More specifically, in thepresent example embodiment, the U direction is set to a directionrotated from the X direction to the −Y direction by a, and the Vdirection is set to a direction rotated from the Y direction to the Xdirection by a. Note that a is an angle greater than 0° and smaller than90°. In one example, a is 45°. A −U direction refers to a directionopposite to the U direction, and a −V direction refers to a directionopposite to the V direction.

As shown in FIG. 10 , a W1 direction and a W2 direction are defined asfollows. The W1 direction is a direction rotated from the V direction tothe −Z direction. The W2 direction is a direction rotated from the Vdirection to the Z direction. More specifically, in the present exampleembodiment, the W1 direction is set to a direction rotated from the Vdirection to the −Z direction by β, and the W2 direction is set to adirection rotated from the V direction to the Z direction by β. Notethat β is an angle greater than 0° and smaller than 90°. A −W1 directionrefers to a direction opposite to the W1 direction, and a −W2 directionrefers to a direction opposite to the W2 direction. The W1 direction andW2 direction both are orthogonal to the U direction.

The first detection circuit 10 is configured to detect a component ofthe target magnetic field in a direction parallel to the U direction andgenerate at least one first detection signal which has a correspondencewith the component. The second detection circuit 20 is configured todetect a component of the target magnetic field in a direction parallelto the W1 direction and generate at least one second detection signalwhich has a correspondence with the component. The third detectioncircuit 30 is configured to detect a component of the target magneticfield in a direction parallel to the W2 direction and generate at leastone third detection signal which has a correspondence with thecomponent.

As shown in FIG. 4 , the first detection circuit 10 includes a powersupply port V1, a ground port G1, signal output ports E11 and E12, afirst resistor section R11, a second resistor section R12, a thirdresistor section R13, and a fourth resistor section R14. The pluralityof MR elements of the first detection circuit 10 constitute the first tofourth resistor sections R11, R12, R13, and R14.

The first resistor section R11 is provided between the power supply portV1 and the signal output port E11. The second resistor section R12 isprovided between the signal output port E11 and the ground port G1. Thethird resistor section R13 is provided between the signal output portE12 and the ground port G1. The fourth resistor section R14 is providedbetween the power supply port V1 and the signal output port E12.

As shown in FIG. 5 , the second detection circuit 20 includes a powersupply port V2, a ground port G2, signal output ports E21 and E22, afirst resistor section R21, a second resistor section R22, a thirdresistor section R23, and a fourth resistor section R24. The pluralityof MR elements of the second detection circuit 20 constitute the firstto fourth resistor sections R21, R22, R23, and R24.

The first resistor section R21 is provided between the power supply portV2 and the signal output port E21. The second resistor section R22 isprovided between the signal output port E21 and the ground port G2. Thethird resistor section R23 is provided between the signal output portE22 and the ground port G2. The fourth resistor section R24 is providedbetween the power supply port V2 and the signal output port E22.

As shown in FIG. 6 , the third detection circuit 30 includes a powersupply port V3, a ground port G3, signal output ports E31 and E32, afirst resistor section R31, a second resistor section R32, a thirdresistor section R33, and a fourth resistor section R34. The pluralityof MR elements of the third detection circuit 30 constitute the first tofourth resistor sections R31, R32, R33, and R34.

The first resistor section R31 is provided between the power supply portV3 and the signal output port E31. The second resistor section R32 isprovided between the signal output port E31 and the ground port G3. Thethird resistor section R33 is provided between the signal output portE32 and the ground port G3. The fourth resistor section R34 is providedbetween the power supply port V3 and the signal output port E32.

A voltage or current of predetermined magnitude is applied to each ofthe power supply ports V1 to V3. Each of the ground ports G1 to G3 isconnected to the ground.

The plurality of MR elements of the first detection circuit 10 willhereinafter be referred to as a plurality of first MR elements 50A. Theplurality of MR elements of the second detection circuit 20 will bereferred to as a plurality of second MR elements 50B. The plurality ofMR elements of the third detection circuit 30 will be referred to as aplurality of third MR elements 50C. Since the first to third detectioncircuits 10, 20, and 30 are components of the magnetic sensor 1, it canbe said that the magnetic sensor 1 includes the plurality of first MRelements 50A, the plurality of second MR elements 50B, and the pluralityof third MR elements 50C. Any given MR element will be denoted by thereference numeral 50.

FIG. 11 is a side view showing the MR elements 50. Each MR element 50may be a spin-valve MR element or an anisotropic magnetoresistive (AMR)element. In particular, in the present example embodiment, each MRelement 50 is a spin-valve MR element. The MR element 50 includes amagnetization pinned layer 52 having a magnetization whose direction isfixed, a free layer 54 having a magnetization whose direction isvariable depending on the direction of a target magnetic field, and agap layer 53 located between the magnetization pinned layer 52 and thefree layer 54. The MR element 50 may be a tunneling magnetoresistive(TMR) element or a giant magnetoresistive (GMR) element. In the TMRelement, the gap layer 53 is a tunnel barrier layer. In the GMR element,the gap layer 53 is a nonmagnetic conductive layer. The resistance ofthe MR element 50 changes with the angle that the magnetizationdirection of the free layer 54 forms with respect to the magnetizationdirection of the magnetization pinned layer 52. The resistance of the MRelement 50 is at its minimum value when the foregoing angle is 0°, andat its maximum value when the foregoing angle is 180°. In each MRelement 50, the free layer 54 has a shape anisotropy that sets thedirection of the magnetization easy axis to be orthogonal to themagnetization direction of the magnetization pinned layer 52. As amethod for setting the magnetization easy axis in a predetermineddirection in the free layer 54, a magnet configured to apply a biasmagnetic field to the free layer 54 can be used.

The MR element 50 further includes an antiferromagnetic layer 51. Theantiferromagnetic layer 51, the magnetization pinned layer 52, the gaplayer 53, and the free layer 54 are stacked in this order. Theantiferromagnetic layer 51 is formed of an antiferromagnetic material,and is in exchange coupling with the magnetization pinned layer 52 tothereby pin the magnetization direction of the magnetization pinnedlayer 52. The magnetization pinned layer 52 may be a so-calledself-pinned layer (Synthetic Ferri Pinned layer, SFP layer). Theself-pinned layer has a stacked ferri structure in which a ferromagneticlayer, a nonmagnetic intermediate layer, and a ferromagnetic layer arestacked, and the two ferromagnetic layers are antiferromagneticallycoupled. In a case where the magnetization pinned layer 52 is theself-pinned layer, the antiferromagnetic layer 51 may be omitted.

It should be appreciated that the layers 51 to 54 of each MR element 50may be stacked in the reverse order to that shown in FIG. 11 .

In FIGS. 4 to 6 , solid arrows represent the magnetization directions ofthe magnetization pinned layers 52 of the MR elements 50. Hollow arrowsrepresent the magnetization directions of the free layers 54 of the MRelements 50 in a case where no target magnetic field is applied to theMR elements 50.

In the example shown in FIG. 4 , the magnetization directions of themagnetization pinned layers 52 in each of the first and third resistorsections R11 and R13 are the U direction. The magnetization directionsof the magnetization pinned layers 52 in each of the second and fourthresistor sections R12 and R14 are the −U direction. The free layer 54 ineach of the plurality of first MR elements 50A has a shape anisotropythat sets the direction of the magnetization easy axis to a directionparallel to the V direction. The magnetization directions of the freelayers 54 in each of the first and second resistor sections R11 and R12in a case where no target magnetic field is applied to the first MRelements 50A are the V direction. The magnetization directions of thefree layers 54 in each of the third and fourth resistor sections R13 andR14 in the foregoing case are the −V direction.

In the example shown in FIG. 5 , the magnetization directions of themagnetization pinned layers 52 in each of the first and third resistorsections R21 and R23 are the W1 direction. The magnetization directionsof the magnetization pinned layers 52 in each of the second and fourthresistor sections R22 and R24 are the −W1 direction. The free layer 54in each of the plurality of second MR elements 50B has a shapeanisotropy that sets the direction of the magnetization easy axis to adirection parallel to the U direction. The magnetization directions ofthe free layers 54 in each of the first and second resistor sections R21and R22 in a case where no target magnetic field is applied to thesecond MR elements 50B are the U direction. The magnetization directionsof the free layers 54 in each of the third and fourth resistor sectionsR23 and R24 in the foregoing case are the −U direction.

In the example shown in FIG. 6 , the magnetization directions of themagnetization pinned layers 52 in each of the first and third resistorsections R31 and R33 are the W2 direction. The magnetization directionsof the magnetization pinned layers 52 in each of the second and fourthresistor sections R32 and R34 are the −W2 direction. The free layer 54in each of the plurality of third MR elements 50C has a shape anisotropythat sets the direction of the magnetization easy axis to a directionparallel to the U direction. The magnetization directions of the freelayers 54 in each of the first and second resistor sections R31 and R32in a case where no target magnetic field is applied to the third MRelements 50C are the U direction. The magnetization directions of thefree layers 54 in each of the third and fourth resistor sections R33 andR34 in the foregoing case are the −U direction.

The magnetic sensor 1 includes a magnetic field generator configured toapply a magnetic field in a predetermined direction to the free layer 54of each of the plurality of first MR elements 50A, the plurality ofsecond MR elements 50B, and the plurality of third MR elements 50C. Inthe example embodiment, the magnetic field generator includes a firstcoil 70 that applies a magnetic field in the predetermined direction tothe free layer 54 in each of the first MR elements 50A, and a secondcoil 80 that applies a magnetic field in the predetermined direction tothe free layer 54 in each of the plurality of second MR elements 50B andthe plurality of third MR elements 50C. The first chip 2 includes thefirst coil 70. The second chip 3 includes the second coil 80.

In view of the manufacturing precision and the like of the MR elements50, the magnetization directions of the magnetization pinned layers 52and the directions of the magnetization easy axes of the free layers 54may be slightly different from the foregoing directions. Themagnetization pinned layers 52 may be magnetized to includemagnetization components having the foregoing directions as their maincomponents. In such a case, the magnetization directions of themagnetization pinned layers 52 are the same or substantially the same asthe foregoing directions.

A specific structure of the first and second chips 2 and 3 will bedescribed in detail below. First, a structure of the first chip 2 willbe described with reference to FIGS. 7 and 8 . FIG. 8 shows a part of across section at the position indicated by the line 8-8 in FIG. 7 .

The first chip 2 includes a substrate 201 having a top surface 201 a,insulating layers 202, 203, 204, 207, 208, 209, and 210, a plurality oflower electrodes 61A, a plurality of upper electrodes 62A, a pluralityof lower coil elements 71, and a plurality of upper coil elements 72.The top surface 201 a of the substrate 201 is parallel to the XY plane.The Z direction is also a direction perpendicular to the top surface 201a of the substrate 201. The coil elements are a part of the coilwinding.

The insulating layer 202 is disposed on the substrate 201. The pluralityof lower coil elements 71 are disposed on the insulating layer 202. Theinsulating layer 203 is disposed around the plurality of lower coilelements 71 on the insulating layer 202. The insulating layer 204 isdisposed on the plurality of lower coil elements 71 and the insulatinglayer 203.

The plurality of lower electrodes 61A are disposed on the insulatinglayer 204. The insulating layer 207 is disposed around the plurality oflower electrodes 61A on the insulating layer 204. The plurality of firstMR elements 50A are disposed on the plurality of lower electrodes 61A.The insulating layer 208 is disposed around the plurality of first MRelements 50A on the plurality of lower electrodes 61A and the insulatinglayer 207. The plurality of upper electrodes 62A are disposed on theplurality of first MR elements 50A and the insulating layer 208. Theinsulating layer 209 is disposed around the plurality of upperelectrodes 62A on the insulating layer 208.

The insulating layer 210 is disposed on the plurality of upperelectrodes 62A and the insulating layer 209. The plurality of upper coilelements 72 are disposed on the insulating layer 210. The first chip 2may further include a not-shown insulating layer that covers theplurality of upper coil elements 72 and the insulating layer 210. FIG. 7shows the insulating layer 204, the plurality of first MR elements 50A,and the plurality of upper coil elements 72 among the components of thefirst chip 2.

The top surface 201 a of the substrate 201 is parallel to the XY plane.The top surface of each of the plurality of lower electrodes 61A is alsoparallel to the XY plane. The reference plane 4 a is parallel to the XYplane. Thus, in the foregoing state, it can be said that the pluralityof first MR elements 50A are disposed on a plane parallel to thereference plane 4 a.

As shown in FIG. 7 , the plurality of first MR elements 50A are disposedso that two or more MR elements 50A are arranged both in the U directionand in the V direction. The plurality of first MR elements 50A areconnected in series by the plurality of lower electrodes 61A and theplurality of upper electrodes 62A.

A method for connecting the plurality of first MR elements 50A will nowbe described in detail with reference to FIG. 11 . In FIG. 11 , thereference numerals 61 denote lower electrodes corresponding to given MRelements 50, and the reference numerals 62 denote upper electrodescorresponding to the MR elements 50. As shown in FIG. 11 , each lowerelectrode 61 has a long slender shape. Two lower electrodes 61 adjoiningin the longitudinal direction of the lower electrodes 61 have a gaptherebetween. MR elements 50 are disposed near both longitudinal ends onthe top surface of each lower electrode 61. Each upper electrode 62 hasa long slender shape, and electrically connects two adjoining MRelements 50 that are disposed on two lower electrodes 61 adjoining inthe longitudinal direction of the lower electrodes 61.

Although not shown in the drawings, an MR element 50 located at the endof a row of MR elements 50 is connected to another MR element 50 locatedat the end of another row of MR elements 50 adjoining in a directionintersecting with the longitudinal direction of the lower electrodes 61.The two MR elements 50 are connected to each other by a not-shownelectrode. The not-shown electrode may be an electrode connecting thebottom surfaces of the two MR elements 50 or the upper surfaces of thesame.

If the MR elements 50 shown in FIG. 11 are first MR elements 50A, thelower electrodes 61 shown in FIG. 11 correspond to lower electrodes 61A,and the upper electrodes 62 shown in FIG. 11 correspond to upperelectrodes 62A. In such a case, the longitudinal direction of the lowerelectrodes 61 is parallel to the V direction.

Each of the plurality of upper coil elements 72 extends in a directionparallel to the Y direction. The plurality of upper coil elements 72 arearranged in the X direction. In particular, in the present exampleembodiment, when seen in the Z direction, each of the plurality of firstMR elements 50A overlaps two upper coil elements 72.

Each of the plurality of lower coil elements 71 extends in a directionparallel to the Y direction. The plurality of lower coil elements 71 arearranged in the X direction. The shape and arrangement of the pluralityof lower coil elements 71 may be the same as or different from those ofthe plurality of upper coil elements 72.

In the example shown in FIGS. 7 and 8 , the plurality of lower coilelements 71 and the plurality of upper coil elements 72 are electricallyconnected to constitute the first coil 70 that applies a magnetic fieldin a direction parallel to the X direction to the free layers 54 of therespective first MR elements 50A. The first coil 70 may be configured sothat a magnetic field in the X direction can be applied to the freelayers 54 in the first and second resistor sections R11 and R12 and amagnetic field in the −X direction can be applied to the free layers 54in the third and fourth resistor sections R13 and R14. The first coil 70may be controlled by the processor 40.

Next, a structure of the second chip 3 will be described with referenceto FIGS. 9 and 10 . FIG. 10 shows a part of a cross section at theposition indicated by the line 10-10 in FIG. 9 .

The second chip 3 includes a substrate 301 having a top surface 301 a,insulating layers 302, 303, 304, 305, 307, 308, 309, and 310, aplurality of lower electrodes 61B, a plurality of lower electrodes 61C,a plurality of upper electrodes 62B, a plurality of upper electrodes62C, a plurality of lower coil elements 81, and a plurality of uppercoil elements 82. The top surface 301 a of the substrate 301 is parallelto the XY plane. The Z direction is a direction perpendicular to the topsurface 301 a of the substrate 301.

The insulating layer 302 is disposed on the substrate 301. The pluralityof lower coil elements 81 are disposed on the insulating layer 302. Theinsulating layer 303 is disposed around the plurality of lower coilelements 81 on the insulating layer 302. The insulating layers 304 and305 are stacked in this order on the plurality of lower coil elements 81and the insulating layer 303.

The plurality of lower electrodes 61B and the plurality of lowerelectrodes 61C are disposed on the insulating layer 305. The insulatinglayer 307 is disposed around the plurality of lower electrodes 61B andaround the plurality of lower electrodes 61C on the insulating layer305. The plurality of second MR elements 50B are disposed on theplurality of lower electrodes 61B. The plurality of third MR elements50C are disposed on the plurality of lower electrodes 61C. Theinsulating layer 308 is disposed around the plurality of second MRelements 50B and around the plurality of third MR elements 50C on theplurality of lower electrodes 61B, the plurality of lower electrodes61C, and the insulating layer 307. The plurality of upper electrodes 62Bare disposed on the plurality of second MR elements 50B and theinsulating layer 308. The plurality of upper electrodes 62C are disposedon the plurality of third MR elements 50C and the insulating layer 308.The insulating layer 309 is disposed around the plurality of upperelectrodes 62B and around the plurality of upper electrodes 62C on theinsulating layer 308.

The insulating layer 310 is disposed on the plurality of upperelectrodes 62B, the plurality of upper electrodes 62C, and theinsulating layer 309. The plurality of upper coil elements 82 aredisposed on the insulating layer 310. The second chip 3 may furtherinclude a not-shown insulating layer that covers the plurality of uppercoil elements 82 and the insulating layer 310.

The second chip 3 includes a support member that supports the pluralityof second MR elements 50B and the plurality of third MR elements 50C.The support member has at least one inclined surface inclined relativeto the top surface 301 a of the substrate 301. In particular, in thepresent example embodiment, the support member includes the insulatinglayer 305. FIG. 9 shows the insulating layer 305, the plurality ofsecond MR elements 50B, the plurality of third MR elements 50C, and theplurality of upper coil elements 82 among the components of the secondchip 3.

The insulating layer 305 includes a plurality of protruding surfaces 305c each protruding in a direction away from the top surface 301 a of thesubstrate 301 (Z direction). The plurality of protruding surfaces 305 ceach extend in the direction parallel to the U direction. The overallshape of each protruding surface 305 c is a triangular roof shapeobtained by moving the triangular shape of the protruding surface 305 cshown in FIG. 10 along the direction parallel to the U direction. Theplurality of protruding surfaces 305 c are arranged in the directionparallel to the V direction.

Now, focus is placed on any one of the plurality of protruding surfaces305 c. The protruding surface 305 c includes a first inclined surface305 a and a second inclined surface 305 b. The first inclined surface305 a is a surface forming a part of the protruding surface 305 c on theside of the V direction. The second inclined surface 305 b is a surfaceforming a part of the protruding surface 305 c on the side of the −Vdirection.

The top surface 301 a of the substrate 301 is parallel to the XY plane.The reference plane 4 a is parallel to the XY plane. The first inclinedsurface 305 a and the second inclined surface 305 b are each inclinedrelative to each of the top surface 301 a of the substrate 301 and thereference plane 4 a. The second inclined surface 305 b faces a directiondifferent from the first inclined surface 305 a. A gap between the firstinclined surface 305 a and the second inclined surface 305 b in a VZcross section perpendicular to the top surface 301 a of the substrate301 becomes smaller in the direction away from the top surface 301 a ofthe substrate 301.

In the example embodiment, there are plurality of protruding surfaces305 c, and thus there are a plurality of first inclined surfaces 305 aand a plurality of second inclined surfaces 305 b. The insulating layer305 includes the plurality of first inclined surfaces 305 a and theplurality of second inclined surfaces 305 b.

The plurality of lower electrodes 61B are disposed on the plurality offirst inclined surfaces 305 a. The plurality of lower electrodes 61C aredisposed on the plurality of second inclined surfaces 305 b. As describeabove, the first and second inclined surfaces 305 a and 305 b are eachinclined relative to the top surface 301 a of the substrate 301, i.e.,the XY plane. The top surface of each of the plurality of lowerelectrodes 61B and the top surface of each of the plurality of lowerelectrode 61C are thus also inclined relative to the XY plane. Thereference plane 4 a is parallel to the XY plane. Thus, it can be saidthat the plurality of second MR elements 50B and the plurality of thirdMR elements 50C are disposed on the inclined surfaces inclined relativeto the reference plane 4 a. The insulating layer 305 is a member forsupporting each of the plurality of second MR elements 50B and theplurality of third MR elements 50C so as to allow each of the MRelements to be inclined relative to the reference plane 4 a.

Each of the plurality of first inclined surfaces 305 a may be a planethat is at least partially parallel to the U direction and the W1direction. Each of the plurality of second inclined surfaces 305 b maybe a plane that is at least partially parallel to the U direction andthe W2 direction.

The protruding surface 305 c may be a semi-cylindrical curved surfaceformed by moving the curved shape (arch shape) along the directionparallel to the U direction. In such a case, the first inclined surface305 a is a curved surface. The second MR elements 50B are curved alongthe curved surface (the first inclined surface 305 a). Even in such acase, the magnetization direction of the magnetization pinned layer 52of each second MR element 50B is defined as a straight direction asdescribed above for convenience sake. Similarly, the second inclinedsurface 305 b is a curved surface. The third MR elements 50C are curvedalong the curved surface (the second inclined surface 305 b). Even insuch a case, the magnetization direction of the magnetization pinnedlayer 52 of each third MR element 50C is defined as a straight directionas described above for convenience sake.

Although not shown, the insulating layer 305 further includes a flatsurface present around the plurality of protruding surfaces 305 c. Theplurality of protruding surfaces 305 c may protrude from the flatsurface in the Z direction. The plurality of protruding surfaces 305 cmay be disposed with predetermined gaps therebetween so that a flatsurface is formed between two adjoining protruding surfaces 305 c.Alternatively, the insulating layer 305 may have groove portionsrecessed from the flat surface in the −Z direction. In such a case, theplurality of protruding surfaces 305 c may be present in the grooveportions.

As shown in FIG. 9 , the plurality of second MR elements 50B aredisposed so that two or more MR elements 50B are arranged both in the Udirection and in the V direction. A plurality of second MR elements 50Bare arranged in a row on one first inclined surface 305 a. Similarly,the plurality of third MR elements 50C are disposed so that two or moreMR elements 50C are arranged both in the U direction and in the Vdirection. A plurality of third MR elements 50C are arranged in a row onone second inclined surface 305 b. In the example embodiment, aplurality of rows of second MR elements 50B and a plurality of rows ofthird MR elements 50C are alternately arranged in the direction parallelto the V direction.

The plurality of second MR elements 50B are connected in series by theplurality of lower electrodes 61B and the plurality of upper electrodes62B. The foregoing description of the method for connecting theplurality of first MR elements 50A also applies to a method forconnecting the plurality of second MR elements 50B. If the MR elements50 shown in FIG. 11 are second MR elements 50B, the lower electrodes 61shown in FIG. 11 correspond to lower electrodes 61B, and the upperelectrodes 62 shown in FIG. 11 correspond to upper electrodes 62B. Insuch a case, the longitudinal direction of the lower electrodes 61 isparallel to the U direction.

Similarly, the plurality of third MR elements 50C are connected inseries by the plurality of lower electrodes 61C and the plurality ofupper electrodes 62C. The foregoing description of the method forconnecting the plurality of first MR elements 50A also applies to amethod for connecting the plurality of third MR elements 50C. If the MRelements 50 shown in FIG. 11 are third MR elements 50C, the lowerelectrodes 61 shown in FIG. 11 correspond to lower electrodes 61C, andthe upper electrodes 62 shown in FIG. 11 correspond to upper electrodes62C. In such a case, the longitudinal direction of the lower electrodes61 is parallel to the U direction.

Each of the plurality of upper coil elements 82 extends in a directionparallel to the Y direction. The plurality of upper coil elements 82 arearranged in the X direction. In particular, in the present exampleembodiment, when seen in the Z direction, each of the plurality ofsecond MR elements 50B and the plurality of third MR elements 50Coverlaps two upper coil elements 82.

Each of the plurality of lower coil elements 81 extends in a directionparallel to the Y direction. The plurality of lower coil elements 81 arearranged in the X direction. The shape and arrangement of the pluralityof lower coil elements 81 may be the same as or different from those ofthe plurality of upper coil elements 82.

In the example shown in FIGS. 9 and 10 , the plurality of lower coilelements 81 and the plurality of upper coil elements 82 are electricallyconnected to constitute the second coil 80 that applies a magnetic fieldin the direction parallel to the X direction to the free layer 54 ineach of the plurality of second MR elements 50B and the plurality ofthird MR elements 50C. The second coil 80 may be configured, forexample, so that a magnetic field in the X direction can be applied tothe free layers 54 in the first and second resistor sections R21 and R22of the second detection circuit 20 and the first and second resistorsections R31 and R32 of the third detection circuit 30, and a magneticfield in the −X direction can be applied to the free layers 54 in thethird and fourth resistor sections R23 and R24 of the second detectioncircuit 20 and the third and fourth resistor sections R33 and R34 of thethird detection circuit 30. The second coil 80 may be controlled by theprocessor 40.

Next, the first to third detection signals will be described. First, thefirst detection signal will be described with reference to FIG. 4 . Asthe strength of the component of the target magnetic field in thedirection parallel to the U direction changes, the resistance of each ofthe resistor sections R11 to R14 of the first detection circuit 10changes either so that the resistances of the resistor sections R11 andR13 increase and the resistances of the resistor sections R12 and R14decrease or so that the resistances of the resistor sections R11 and R13decrease and the resistances of the resistor sections R12 and R14increase. Thereby the electric potential of each of the signal outputports E11 and E12 changes. The first detection circuit 10 generates asignal corresponding to the electric potential of the signal output portE11 as a first detection signal S11, and generates a signalcorresponding to the electric potential of the signal output port E12 asa first detection signal S12.

Next, the second detection signal will be described with reference toFIG. 5 . As the strength of the component of the target magnetic fieldin the direction parallel to the W1 direction changes, the resistance ofeach of the resistor sections R21 to R24 of the second detection circuit20 changes either so that the resistances of the resistor sections R21and R23 increase and the resistances of the resistor sections R22 andR24 decrease or so that the resistances of the resistor sections R21 andR23 decrease and the resistances of the resistor sections R22 and R24increase. Thereby the electric potential of each of the signal outputports E21 and E22 changes. The second detection circuit 20 generates asignal corresponding to the electric potential of the signal output portE21 as a second detection signal S21, and generates a signalcorresponding to the electric potential of the signal output port E22 asa second detection signal S22.

Next, the third detection signal will be described with reference toFIG. 6 . As the strength of the component of the target magnetic fieldin the direction parallel to the W2 direction changes, the resistance ofeach of the resistor sections R31 to R34 of the third detection circuit30 changes either so that the resistances of the resistor sections R31and R33 increase and the resistances of the resistor sections R32 andR34 decrease or so that the resistances of the resistor sections R31 andR33 decrease and the resistances of the resistor sections R32 and R34increase. Thereby the electric potential of each of the signal outputports E31 and E32 changes. The third detection circuit 30 generates asignal corresponding to the electric potential of the signal output portE31 as a third detection signal S31, and generates a signalcorresponding to the electric potential of the signal output port E32 asa third detection signal S32.

Next, an operation of the processor 40 will be described. The processor40 is configured to generate the first detection value based on thefirst detection signals S11 and S12. The first detection value is adetection value corresponding to the component of the target magneticfield in the direction parallel to the U direction. The first detectionvalue will hereinafter be represented by the symbol Su.

In the present example embodiment, the processor 40 generates the firstdetection value Su by an arithmetic including obtainment of a differenceS11−S12 between the first detection signal S11 and the first detectionsignal S12. The first detection value Su may be the difference S11−S12itself. The first detection value Su may be a result of predeterminedcorrections, such as gain adjustment and offset adjustment, made on thedifference S11−S12.

The processor 40 is further configured to generate the second and thirddetection values based on the second detection signals S21 and S22 andthe third detection signals S31 and S32. The second detection value is adetection value corresponding to the component of the target magneticfield in the direction parallel to the V direction. The third detectionvalue is a detection value corresponding to the component of the targetmagnetic field in the direction parallel to the Z direction.Hereinafter, the second detection value is represented by a symbol Sv,and the third detection value is represented by a symbol Sz.

The processor 40 generates the second and third detection values Sv andSz as follows, for example. First, the processor 40 generates a value S1by an arithmetic including obtainment of the difference S21−S22 betweenthe second detection signal S21 and the second detection signal S22, andgenerates a value S2 by an arithmetic including obtainment of thedifference S31−S32 between the third detection signal S31 and the thirddetection signal S32. Next, the processor 40 calculates values S3 and S4using the following expressions (1) and (2).

S3=(S2+S1)/(2 cos α)  (1)

S4=(S2−S1)/(2 sin α)  (2)

The second detection value Sv may be the value S3 itself, or may be aresult of predetermined corrections, such as a gain adjustment and anoffset adjustment, made to the value S3. In the same manner, the thirddetection value Sz may be the value S4 itself, or may be a result ofpredetermined corrections, such as a gain adjustment and an offsetadjustment, made to the value S4.

Next, structural features of the magnetic sensor device 100 according tothe present example embodiment will be described. FIG. 12 is a plan viewshowing the magnetic sensor device 100.

First, the plurality of terminals will be described. The first chip 2includes two end portions 2 c and 2 d located at both ends in thedirection parallel to the Y direction, and two end portions 2 e and 2 flocated at both ends in the direction parallel to the X direction. Theend portion 2 c is located at an end of the first chip 2 in the −Ydirection. The end portion 2 d is located at an end of the first chip 2in the Y direction. The end portion 2 e is located at an end of thefirst chip 2 in the −X direction. The end portion 2 f is located at anend of the first chip 2 in the X direction. In particular, in thepresent example embodiment, the four end portions 2 c to 2 f are alsofour side surfaces connecting the top surface 2 a and the bottom surface2 b of the first chip 2.

The magnetic sensor 1 includes a plurality of sensor terminals providedon the first chip 2. The plurality of sensor terminals of the first chip2 include a plurality of signal terminals 211 and 212 and a plurality ofpower supply terminals 221, 222, 223, and 224. The signal terminals 211and 212 are both disposed on the side of the end portion 2 c of thefirst chip 2. The power supply terminal 221 is disposed on the side ofthe end portion 2 c of the first chip 2. In particular, in the presentexample embodiment, the signal terminals 211 and 212 and the powersupply terminal 221 are arranged in this order in the X direction alongthe end portion 2 c of the first chip 2.

The power supply terminals 222 to 224 are disposed on the side of theend portion 2 d of the first chip 2. In particular, in the presentexample embodiment, the power supply terminals 222 to 224 are arrangedin this order in the X direction along the end portion 2 d of the firstchip 2. In the first chip 2, the number of terminals disposed on theside of the end portion 2 c of the first chip 2 and the number ofterminals disposed on the side of the end portion 2 d of the first chip2 are equal.

The second chip 3 includes two end portions 3 c and 3 d located at bothends in the direction parallel to the Y direction, and two end portions3 e and 3 f located at both ends in the direction parallel to the Xdirection. The end portion 3 c is located at an end of the second chip 3in the −Y direction. The end portion 3 d is located at an end of thesecond chip 3 in the Y direction. The end portion 3 e is located at anend of the second chip 3 in the −X direction. The end portion 3 f islocated at an end of the second chip 3 in the X direction. Inparticular, in the present example embodiment, the four end portions 3 cto 3 f are also four side surfaces connecting the top surface 3 a andthe bottom surface 3 b of the second chip 3.

The magnetic sensor 1 further includes a plurality of sensor terminalsprovided on the second chip 3. The plurality of sensor terminals of thesecond chip 3 include a plurality of signal terminals 311, 312, 313, and314 and a plurality of power supply terminals 321, 322, 323, 324, 325,326, 327, and 328. The signal terminals 311 to 314 are all disposed onthe side of the end portion 3 c of the second chip 3. The power supplyterminals 321 and 322 are disposed on the side of the end portion 3 c ofthe second chip 3. In particular, in the present example embodiment, thepower supply terminals 321 and 322 and the signal terminals 311 to 314are arranged in this order in the X direction along the end portion 3 cof the second chip 3.

The power supply terminals 323 to 328 are disposed on the side of theend portion 3 d of the second chip 3. In particular, in the presentexample embodiment, the power supply terminals 323 to 328 are arrangedin this order in the X direction along the end portion 3 d of the secondchip 3. In the second chip 3, the number of terminals disposed on theside of the end portion 3 c of the second chip 3 and the number ofterminals disposed on the side of the end portion 3 d of the second chip3 are equal.

The first chip 2 and the second chip 3 are arranged in this order alongthe X direction. In particular, in the present example embodiment, thefirst chip 2 and the second chip 3 are disposed such that the powersupply terminal 221 of the first chip 2 and the power supply terminal321 of the second chip 3 adjoin each other.

The signal terminals 211 and 212 and the power supply terminal 221 ofthe first chip 2, and the power supply terminals 321 and 322 and thesignal terminals 311 to 314 of the second chip 3 are arranged in a rowalong the direction parallel to the Y direction. Note that at least someof such terminals may be disposed at the same position in the directionparallel to the Y direction, or may be disposed at different positionsin the direction parallel to the Y direction.

The power supply terminals 222 to 224 of the first chip 2 and the powersupply terminals 323 to 328 of the second chip 3 are arranged in a rowalong the direction parallel to the Y direction. Note that at least someof such terminals may be disposed at the same position in the directionparallel to the Y direction, or may be disposed at different positionsin the direction parallel to the Y direction.

The number of terminals provided on the first chip 2 is 6. The number ofterminals provided on the second chip 3 is 12, which is larger than thenumber of terminals provided on the first chip 2.

The circuit main body 4 includes two end portions 4 c and 4 d located atboth ends in the direction parallel to the Y direction, and two endportions 4 e and 4 f located at both ends in the direction parallel tothe X direction. The end portion 4 c is located at an end of the circuitmain body 4 in the −Y direction. The end portion 4 d is located at anend of the circuit main body 4 in the Y direction. The end portion 4 eis located at an end of the circuit main body 4 in the −X direction. Theend portion 4 f is located at an end of the circuit main body 4 in the Xdirection. In particular, in the present example embodiment, the fourend portions 4 c to 4 f are also four side surfaces connecting thereference plane 4 a and the bottom surface 4 b of the circuit main body4.

The signal processing circuit 14 includes a plurality of circuitterminals provided on the circuit main body 4. The plurality of circuitterminals include a plurality of signal terminals 411, 412, 413, 414,415, and 416 and a plurality of power supply terminals 421, 422, 423,424, 425, 426, 427, and 428. The signal terminals 411 to 416 are alldisposed on the side of the end portion 4 c of the circuit main body 4.The power supply terminal 421 is disposed on the side of the end portion4 c of the circuit main body 4. In particular, in the present exampleembodiment, the signal terminals 411 and 412, the power supply terminal421, and the signal terminals 413 to 416 are arranged in this order inthe X direction along the end portion 4 c of the circuit main body 4.

The power supply terminals 422 to 428 are disposed on the side of theend portion 4 d of the circuit main body 4. In particular, in thepresent example embodiment, the power supply terminals 422 to 428 arearranged in this order in the X direction along the end portion 4 d ofthe circuit main body 4.

The first and second chips 2 and 3 are disposed between the terminals411 to 416 and 421 and the terminals 422 to 428.

The signal processing circuit 14 may further include a plurality ofnot-shown terminals provided on the circuit main body 4 and connected tothe printed board 5. The plurality of not-shown terminals may bedisposed on the side of the end portion 4 e or the side of the endportion 4 f of the circuit main body 4, for example.

Next, connection relationships between the plurality of terminals willbe described. Two given terminals of the plurality of terminals areconnected by a bonding wire, for example. Note that the bonding wire isomitted in FIGS. 1 and 2 .

The signal terminals 411 to 416 and the power supply terminal 421 of thecircuit main body 4 are arranged in a row. The signal terminals 211 and212 and the power supply terminal 221 of the first chip 2 and the signalterminals 311 to 314 and the power supply terminals 321 and 322 of thesecond chip 3 are arranged in a row along the signal terminals 411 to416 and the power supply terminal 421 of the circuit main body 4.

The power supply terminals 422 to 428 of the circuit main body 4 arearranged in a row. The power supply terminals 222 to 224 of the firstchip 2 and the power supply terminals 323 to 328 of the second chip 3are arranged in a row along the power supply terminals 422 to 428 of thecircuit main body 4.

The signal terminals 211 and 212 of the first chip 2 are respectivelyconnected to the signal terminals 411 and 412 of the circuit main body4. The power supply terminals 221 and 224 of the first chip 2 arerespectively connected to the power supply terminals 321 and 323 of thesecond chip 3. The power supply terminals 222 and 223 of the first chip2 are respectively connected to the power supply terminals 422 and 423of the circuit main body 4.

The signal terminals 311, 312, 313, and 314 of the second chip 3 arerespectively connected to the signal terminals 413, 414, 415, and 416 ofthe circuit main body 4. The power supply terminals 322, 324, 325, 326,327, and 328 of the second chip 3 are respectively connected to thepower supply terminals 421, 424, 425, 426, 427, and 428 of the circuitmain body 4.

Next, relationships between the plurality of terminals and the circuitcomponents shown in FIGS. 3 to 6 will be described. The signal terminals211 and 212 and the power supply terminals 221 and 223 provided on thefirst chip 2 are electrically connected to the first detection circuit10 shown in FIG. 4 . The signal terminals 211 and 212 are respectivelyelectrically connected to the signal output ports E11 and E12. The powersupply terminal 221 is electrically connected to the ground port G1. Thepower supply terminal 223 is electrically connected to the power supplyport V1. The power supply terminals 222 and 224 are connected to thefirst coil 70 shown in FIG. 3 , and are used as terminals for the coil.

The signal terminals 311 to 314 and the power supply terminals 321, 322,326, and 327 provided on the second chip 3 are electrically connected tothe second detection circuit 20 shown in FIG. 5 and to the thirddetection circuit 30 shown in FIG. 6 . The signal terminals 311, 312,313, and 314 are respectively electrically connected to the signaloutput ports E21, E22, E31, and E32. The power supply terminals 321 and322 are each electrically connected to both the ground ports G2 and G3.The power supply terminals 326 and 327 are respectively electricallyconnected to the power supply ports V2 and V3. The power supplyterminals 323 to 325 and 328 are connected to the second coil 80 shownin FIG. 3 , and are used as terminals for the coil.

The power supply terminals 221, 321, and 322 are electrically connectedto the power supply terminal 421 of the circuit main body 4. The powersupply terminals 221, 321, 322, and 421 are connected to the ground.

Next, an example of the configuration of the signal processing circuit14 will be described with reference to FIG. 13 . FIG. 13 is a plan viewshowing a plurality of blocks in the signal processing circuit 14.

The signal processing circuit 14 includes at least a first block 431 anda second block 432 provided in the circuit main body 4. The first block431 is configured to process the first detection signals S1 l and S12,the second detection signals S21 and S22, and the third detectionsignals S31 and S32 of the magnetic sensor 1.

The first block 431 is disposed at a position closer to the end portion4 c of the circuit main body 4 than a position where the second block432 is disposed. Thus, the first block 431 is disposed at a positioncloser to the signal terminals 411 to 416 than a position where thesecond block 432 is disposed.

The first block 431 may include an analog front-end block 4311 and adigital signal processing block 4312 connected to the analog front-endblock 4311, for example. The analog front-end block 4311 is connected tothe signal output ports E11 and E12 of the first detection circuit 10shown in FIG. 4 , the signal output ports E21 and E22 of the seconddetection circuit 20 shown in FIG. 5 , and the signal output ports E31and E32 of the third detection circuit 30 shown in FIG. 6 via the signalterminals 211, 212, 311 to 314, and 411 to 416. The analog front-endblock 4311 executes a predetermined process on the first detectionsignals S11 and S12, the second detection signals S21 and S22, and thethird detection signals S31 and S32, and also executes a process ofconverting the first detection signals S11 and S12, the second detectionsignals S21 and S22, and the third detection signals S31 and S32 intodigital signals.

The digital signal processing block 4312 executes a predeterminedprocess on the first detection signals S11 and S12, the second detectionsignals S21 and S22, and the third detection signals S31 and S32, whichhave been converted into digital signals, to generate the first to thirddetection values Su, Sv, and Sz.

The second block 432 is configured to supply power to the magneticsensor 1. The second block 432 is disposed at a position closer to theend portion 4 d of the circuit main body 4 than a position where thefirst block 431 is disposed. Thus, the second block 432 is disposed at aposition closer to the power supply terminals 422 to 428 than a positionwhere the first block 431 is disposed.

The second block 432 may include a first power supply block 4321 and asecond power supply block 4322, for example. The first power supplyblock 4321 is configured to supply power to each of the first to thirddetection circuits 10, 20, and 30. In other words, the first powersupply block 4321 is connected to the power supply port V1 and theground port G1 of the first detection circuit 10 shown in FIG. 4 , thepower supply port V2 and the ground port G2 of the second detectioncircuit 20 shown in FIG. 5 , and the power supply port V3 and the groundport G3 of the third detection circuit 30 shown in FIG. 6 via the powersupply terminals 221, 223, 321, 322, 326, 327, 421, 423, 426, and 427.

The second power supply block 4322 is configured to supply power to eachof the first and second coils 70 and 80. In other words, the secondpower supply block 4322 is connected to the first coil 70 and the secondcoil 80 shown in FIG. 3 via the power supply terminals 222, 224, 323 to325, 328, 422, 424, 425, and 428.

The signal processing circuit 14 further includes a plurality ofnot-shown wires provided on the circuit main body 4 and connecting thefirst power supply block 4321 and the power supply terminals 421, 423,426, and 427. The plurality of wires include a first wire having apredetermined length and forming a part of a path from the first tothird detection circuits 10, 20, and 30 to the first power supply block4321.

The signal processing circuit 14 further includes a plurality ofnot-shown wires provided on the circuit main body 4 and connecting thesecond power supply block 4322 and the power supply terminals 422, 424,425, and 428. The plurality of wires include a second wire having apredetermined length and forming a part of a path from the first andsecond coils 70 and 80 to the second power supply block 4322.

The width of the first wire is smaller than the width of the secondwire. In other words, the width of the second wire is greater than thewidth of the first wire. The width of the second wire may be in therange of 1.2 times to 500 times the width of the first wire, forexample.

The signal processing circuit 14 further includes an interface block 433and an auxiliary circuit block 434. The interface block 433 isconfigured to be able to output the first to third detection values Su,Sv, and Sz as digital signals to the outside of the signal processingcircuit 14.

The interface block 433 may be disposed between the first block 431 andthe end portion 4 e of the circuit main body 4, for example. Theauxiliary circuit block 434 may be disposed between the first block 431and the second block 432, for example.

Next, operations and effects of the magnetic sensor 1, the signalprocessing circuit 14, and the magnetic sensor device 100 according tothe present example embodiment will be described. In the present exampleembodiment, the signal terminals 211 and 212 of the magnetic sensor 1provided on the first chip 2 are both disposed on the side of the endportion 2 c of the first chip 2. The power supply terminals 221 to 224of the magnetic sensor 1 provided on the first chip 2 include at leastone first terminal disposed on the side of the end portion 2 c of thefirst chip 2, and a plurality of second terminals disposed on the sideof the end portion 2 d of the first chip 2. In particular, in thepresent example embodiment, the at least one first terminal correspondsto the power supply terminal 221, and the plurality of second terminalscorrespond to the power supply terminals 222 to 224. According to thepresent example embodiment, the dimension of the first chip 2 in thedirection parallel to the X direction can be reduced in comparison witha case where the power supply terminals 221 to 224 are all disposed onthe side of the end portion 2 d of the first chip 2.

In the present example embodiment, the signal terminals 311 to 314 ofthe magnetic sensor 1 provided on the second chip 3 are all disposed onthe side of the end portion 3 c of the second chip 3. The power supplyterminals 321 to 328 of the magnetic sensor 1 provided on the secondchip 3 include at least one first terminal disposed on the side of theend portion 3 c of the second chip 3, and a plurality of secondterminals disposed on the side of the end portion 3 d of the second chip3. In particular, in the present example embodiment, the at least onefirst terminal corresponds to the power supply terminals 321 and 322,and the plurality of second terminals correspond to the power supplyterminals 323 to 328. According to the present example embodiment, thedimension of the second chip 3 in the direction parallel to the Xdirection can be reduced in comparison with a case where the powersupply terminals 321 to 328 are all disposed on the side of the endportion 3 d of the second chip 3.

In the present example embodiment, the signal terminals 411 to 416 ofthe signal processing circuit 14 provided on the circuit main body 4 areall disposed on the side of the end portion 4 c of the circuit main body4. The power supply terminals 421 to 428 of the signal processingcircuit 14 provided on the circuit main body 4 include at least onefirst terminal disposed on the side of the end portion 4 c of thecircuit main body 4, and a plurality of second terminals disposed on theside of the end portion 4 d of the circuit main body 4. In particular,in the present example embodiment, the at least one first terminalcorresponds to the power supply terminal 421, and the plurality ofsecond terminals correspond to the power supply terminals 422 to 428.According to the present example embodiment, the signal processingcircuit 14 can be used as a signal processing circuit for the first andsecond chips 2 and 3 with the foregoing features.

By the way, in the signal processing circuit 14, the width of each of aplurality of power supply wires connected to the first to thirddetection circuits 10, 20, and 30 can be made smaller than the width ofeach of a plurality of power supply wires connected to the first andsecond coils 70 and 80. Parasitic capacitance of a wire becomes smalleras the width of the wire is smaller. It is preferable to dispose powersupply terminals for the first to third detection circuits 10, 20, and30 on the side of the end portion 4 c of the circuit main body 4 fromthe perspective of suppressing noise generated due to mutualinterference with a plurality of signal wires connected to the first tothird detection circuits 10, 20, and 30.

As described above, in the present example embodiment, the power supplyterminal 421 is disposed on the side of the end portion 4 c of thecircuit main body 4. The power supply terminal 221 electricallyconnected to the ground port G1 shown in FIG. 5 , and the power supplyterminals 321 and 322 each electrically connected to both the groundport G2 shown in FIG. 6 and the ground port G3 shown in FIG. 7 areconnected to the power supply terminal 421. In other words, the powersupply terminal 421 is used as a terminal for the first to thirddetection circuits 10, 20, and 30. Thereby according to the presentexample embodiment, noise can be suppressed.

Modification Example

Next, a modification example of the magnetic sensor device 100 accordingto the present example embodiment will be described with reference toFIG. 14 . FIG. 14 is a plan view showing the modification example of themagnetic sensor device 100.

In the modification example, the magnetic sensor 1 includes power supplyterminals 231, 232, and 233 provided on the first chip 2 instead of thepower supply terminals 222 to 224. The power supply terminals 231 to 233are disposed on the side of the end portion 2 e of the first chip 2. Inparticular, in the present example embodiment, the power supplyterminals 231 to 233 are arranged in this order in the Y direction alongthe end portion 2 e of the first chip 2.

In the modification example, the magnetic sensor 1 also includes powersupply terminals 331, 332, 333, 334, 335, and 336 provided on the secondchip 3 instead of the power supply terminals 323 to 328. The powersupply terminals 331 to 336 are disposed on the side of the end portion3 f of the second chip 3. In particular, in the present exampleembodiment, the power supply terminals 331 to 336 are arranged in thisorder in the Y direction along the end portion 3 f of the second chip 3.

In the modification example, the signal processing circuit 14 includespower supply terminals 441, 442, 443, 444, 445, 446, 447, 448, and 449provided on the circuit main body 4 instead of the power supplyterminals 422 to 428. The power supply terminals 441 to 443 are disposedon the side of the end portion 4 e of the circuit main body 4. Inparticular, in the present example embodiment, the power supplyterminals 441 to 443 are arranged in this order in the Y direction alongthe end portion 4 e of the circuit main body 4.

The power supply terminals 444 to 449 are disposed on the side of theend portion 4 f of the circuit main body 4. In particular, in thepresent example embodiment, the power supply terminals 444 to 449 arearranged in this order in the Y direction along the end portion 4 f ofthe circuit main body 4.

The power supply terminals 231 to 233 of the first chip 2 arerespectively connected to the power supply terminals 441 to 443 of thecircuit main body 4. The power supply terminals 331 to 336 of the secondchip 3 are respectively connected to the power supply terminals 444 to449 of the circuit main body 4.

Relationships between the power supply terminals 231 to 233 and thecircuit components shown in FIGS. 3 to 6 are similar to therelationships between the power supply terminals 222 to 224 and thecircuit components shown in FIGS. 3 to 6 . Relationships between thepower supply terminals 331 to 336 and the circuit components shown inFIGS. 3 to 6 are similar to the relationships between the power supplyterminals 323 to 328 and the circuit components shown in FIGS. 3 to 6 .

The technology is not limited to the foregoing example embodiment, andvarious modifications may be made thereto. For example, the magneticsensor of the technology may include a plurality of chips that areintegrated.

Connection between the plurality of terminals of each of the first andsecond chips 2 and 3 and the plurality of terminals of the circuit mainbody 4 may be made not only by bonding wires but also by plated wires orbumps. The first chip 2 and the second chip 3 may also be mounted on thecircuit main body 4 by the flip chip method.

As described above, the magnetic sensor according to one embodiment ofthe technology includes at least one sensor main body; a detectioncircuit provided on the at least one sensor main body, the detectioncircuit including a magnetic detection element; and a plurality ofsensor terminals provided on the at least one sensor main body. Theplurality of sensor terminals include a plurality of signal terminalsand a plurality of power supply terminals. The plurality of signalterminals are all disposed on a side of one end of the at least onesensor main body. The plurality of power supply terminals include atleast one first terminal disposed on the side of the one end of the atleast one sensor main body, and a plurality of second terminals disposedon a side of another end of the at least one sensor main body.

In the magnetic sensor according to one embodiment of the technology,the at least one first terminal may be connected to a ground. The atleast one first terminal may be electrically connected to the detectioncircuit.

In the magnetic sensor according to one embodiment of the technology, asum of the number of the plurality of signal terminals and the number ofthe at least one first terminal may be equal to the number of theplurality of second terminals.

The magnetic sensor according to one embodiment of the technology mayfurther include a coil provided on the at least one sensor main body,the coil being configured to generate a magnetic field to be applied tothe magnetic detection element. The plurality of second terminals mayinclude a plurality of terminals for the coil.

In the magnetic sensor according to one embodiment of the technology,the at least one sensor main body may include a first sensor main bodyand a second sensor main body. The first sensor main body and the secondsensor main body may be disposed such that the at least one firstterminal of the first sensor main body and the at least one firstterminal of the second sensor main body adjoin each other. The pluralityof signal terminals and the at least one first terminal of the firstsensor main body and the plurality of signal terminals and the at leastone first terminal of the second sensor main body may be arranged in arow. The plurality of second terminals of the first sensor main body andthe plurality of second terminals of the second sensor main body may bearranged in a row. The detection circuit of the first sensor main bodymay be configured to detect a component of a target magnetic field in afirst direction. The detection circuit of the second sensor main bodymay be configured to detect a component of the target magnetic field ina second direction and a component of the target magnetic field in athird direction.

The signal processing circuit according to one embodiment of thetechnology is a signal processing circuit for a magnetic sensor. Thesignal processing circuit may include a circuit main body; a first blockprovided on the circuit main body, the first block being configured toprocess a detection signal of the magnetic sensor; a second blockprovided on the circuit main body, the second block being configured tosupply power to the magnetic sensor; and a plurality of circuitterminals provided on the circuit main body. The plurality of circuitterminals include a plurality of signal terminals and a plurality ofpower supply terminals. The plurality of signal terminals are alldisposed on a side of one end of the circuit main body. The plurality ofpower supply terminals include at least one first terminal disposed onthe side of the one end of the circuit main body, and a plurality ofsecond terminals disposed on a side of another end of the circuit mainbody.

In the signal processing circuit according to one embodiment of thetechnology, the at least one first terminal may be connected to aground.

In the signal processing circuit according to one embodiment of thetechnology, the plurality of signal terminals and the at least one firstterminal may be a plurality of terminals arranged in a row. Theplurality of signal terminals may include a terminal located at one endof the row of the plurality of terminals, and a terminal located atanother end of the row of the plurality of terminals.

The magnetic sensor device according to one embodiment of the technologyincludes a magnetic sensor and a signal processing circuit for themagnetic sensor. The magnetic sensor includes at least one sensor mainbody, a detection circuit provided on the at least one sensor main body,the detection circuit including a magnetic detection element, and aplurality of sensor terminals provided on the at least one sensor mainbody. The plurality of sensor terminals include a plurality of firstsignal terminals and a plurality of first power supply terminals. Theplurality of first signal terminals are all disposed on a side of oneend of the at least one sensor main body. The plurality of first powersupply terminals include at least one first terminal disposed on theside of the one end of the at least one sensor main body, and aplurality of second terminals disposed on a side of another end of theat least one sensor main body.

The signal processing circuit includes a circuit main body, a firstblock provided on the circuit main body, the first block beingconfigured to process a detection signal of the magnetic sensor, asecond block provided on the circuit main body, the second block beingconfigured to supply power to the magnetic sensor, and a plurality ofcircuit terminals provided on the circuit main body. The plurality ofcircuit terminals include a plurality of second signal terminalsrespectively electrically connected to the plurality of first signalterminals, and a plurality of second power supply terminals respectivelyelectrically connected to the plurality of first power supply terminals.The plurality of second signal terminals are all disposed on a side ofone end of the circuit main body. The plurality of second power supplyterminals include at least one third terminal disposed on the side ofthe one end of the circuit main body, and a plurality of fourthterminals disposed on a side of another end of the circuit main body.

In the magnetic sensor device according to one embodiment of thetechnology, each of the at least one first terminal and the at least onethird terminal may be connected to a ground.

In the magnetic sensor device according to one embodiment of thetechnology, the magnetic sensor may further include a coil provided onthe at least one sensor main body, the coil being configured to generatea magnetic field to be applied to the magnetic detection element. Theplurality of second terminals may include a plurality of terminals forthe coil. The signal processing circuit may include a first wire havinga predetermined length and forming a part of a path from the detectioncircuit to the second block, and a second wire having a predeterminedlength and forming a part of a path from the coil to the second block. Awidth of the first wire may be smaller than a width of the second wire.

In the magnetic sensor device according to one embodiment of thetechnology, the plurality of second signal terminals and the at leastone third terminal may be arranged in a row. The plurality of firstsignal terminals and the at least one first terminal may be arranged ina row along the plurality of second signal terminals and the at leastone third terminal. The plurality of fourth terminals may be arranged ina row. The plurality of second terminals may be arranged in a row alongthe plurality of fourth terminals.

In the magnetic sensor device according to one embodiment of thetechnology, the at least one sensor main body may include a first sensormain body and a second sensor main body. The at least one first terminalof the first sensor main body may include one first terminal. The atleast one first terminal of the second sensor main body may include twofirst terminals. The at least one third terminal of the circuit mainbody may include one third terminal. The at least one third terminal ofthe circuit main body may include one third terminal. One of the twofirst terminals and the one third terminal may be electricallyconnected. The detection circuit of the first sensor main body may beconfigured to detect a component of a target magnetic field in a firstdirection. The detection circuit of the second sensor main body may beconfigured to detect a component of the target magnetic field in asecond direction and a component of the target magnetic field in a thirddirection.

Obviously, various modification examples and variations of thetechnology are possible in the light of the above teachings. Thus, it isto be understood that, within the scope of the appended claims andequivalents thereof, the technology may be practiced in otherembodiments than the foregoing example embodiment.

What is claimed is:
 1. A magnetic sensor comprising: at least one sensormain body; a detection circuit provided on the at least one sensor mainbody, the detection circuit including a magnetic detection element; anda plurality of sensor terminals provided on the at least one sensor mainbody, wherein: the plurality of sensor terminals include a plurality ofsignal terminals and a plurality of power supply terminals; theplurality of signal terminals are all disposed on a side of one end ofthe at least one sensor main body; and the plurality of power supplyterminals include at least one first terminal disposed on the side ofthe one end of the at least one sensor main body, and a plurality ofsecond terminals disposed on a side of another end of the at least onesensor main body.
 2. The magnetic sensor according to claim 1, whereinthe at least one first terminal is connected to a ground.
 3. Themagnetic sensor according to claim 2, wherein the at least one firstterminal is electrically connected to the detection circuit.
 4. Themagnetic sensor according to claim 1, wherein a sum of the number of theplurality of signal terminals and the number of the at least one firstterminal is equal to the number of the plurality of second terminals. 5.The magnetic sensor according to claim 1, further comprising a coilprovided on the at least one sensor main body, the coil being configuredto generate a magnetic field to be applied to the magnetic detectionelement, wherein the plurality of second terminals include a pluralityof terminals for the coil.
 6. The magnetic sensor according to claim 1,wherein the at least one sensor main body includes a first sensor mainbody and a second sensor main body.
 7. The magnetic sensor according toclaim 6, wherein the first sensor main body and the second sensor mainbody are disposed such that the at least one first terminal of the firstsensor main body and the at least one first terminal of the secondsensor main body adjoin each other.
 8. The magnetic sensor according toclaim 6, wherein: the plurality of signal terminals and the at least onefirst terminal of the first sensor main body and the plurality of signalterminals and the at least one first terminal of the second sensor mainbody are arranged in a row; and the plurality of second terminals of thefirst sensor main body and the plurality of second terminals of thesecond sensor main body are arranged in a row.
 9. The magnetic sensoraccording to claim 6, wherein: the detection circuit of the first sensormain body is configured to detect a component of a target magnetic fieldin a first direction; and the detection circuit of the second sensormain body is configured to detect a component of the target magneticfield in a second direction and a component of the target magnetic fieldin a third direction.
 10. A signal processing circuit for a magneticsensor, comprising: a circuit main body; a first block provided on thecircuit main body, the first block being configured to process adetection signal of the magnetic sensor; a second block provided on thecircuit main body, the second block being configured to supply power tothe magnetic sensor; and a plurality of circuit terminals provided onthe circuit main body, wherein: the plurality of circuit terminalsinclude a plurality of signal terminals and a plurality of power supplyterminals; the plurality of signal terminals are all disposed on a sideof one end of the circuit main body; and the plurality of power supplyterminals include at least one first terminal disposed on the side ofthe one end of the circuit main body, and a plurality of secondterminals disposed on a side of another end of the circuit main body.11. The signal processing circuit according to claim 10, wherein the atleast one first terminal is connected to a ground.
 12. The signalprocessing circuit according to claim 10, wherein: the plurality ofsignal terminals and the at least one first terminal are a plurality ofterminals arranged in a row; and the plurality of signal terminalsinclude a terminal located at one end of the row of the plurality ofterminals, and a terminal located at another end of the row of theplurality of terminals.
 13. A magnetic sensor device comprising amagnetic sensor and a signal processing circuit for the magnetic sensor,wherein: the magnetic sensor includes at least one sensor main body, adetection circuit provided on the at least one sensor main body, thedetection circuit including a magnetic detection element, and aplurality of sensor terminals provided on the at least one sensor mainbody; the plurality of sensor terminals include a plurality of firstsignal terminals and a plurality of first power supply terminals; theplurality of first signal terminals are all disposed on a side of oneend of the at least one sensor main body; the plurality of first powersupply terminals include at least one first terminal disposed on theside of the one end of the at least one sensor main body, and aplurality of second terminals disposed on a side of another end of theat least one sensor main body; the signal processing circuit includes acircuit main body, a first block provided on the circuit main body, thefirst block being configured to process a detection signal of themagnetic sensor, a second block provided on the circuit main body, thesecond block being configured to supply power to the magnetic sensor,and a plurality of circuit terminals provided on the circuit main body;the plurality of circuit terminals include a plurality of second signalterminals respectively electrically connected to the plurality of firstsignal terminals, and a plurality of second power supply terminalsrespectively electrically connected to the plurality of first powersupply terminals; the plurality of second signal terminals are alldisposed on a side of one end of the circuit main body; and theplurality of second power supply terminals include at least one thirdterminal disposed on the side of the one end of the circuit main body,and a plurality of fourth terminals disposed on a side of another end ofthe circuit main body.
 14. The magnetic sensor device according to claim13, wherein each of the at least one first terminal and the at least onethird terminal is connected to a ground.
 15. The magnetic sensor deviceaccording to claim 13, wherein: the magnetic sensor further includes acoil provided on the at least one sensor main body, the coil beingconfigured to generate a magnetic field to be applied to the magneticdetection element; and the plurality of second terminals include aplurality of terminals for the coil.
 16. The magnetic sensor deviceaccording to claim 13, wherein: the magnetic sensor further includes acoil provided on the at least one sensor main body, the coil beingconfigured to generate a magnetic field to be applied to the magneticdetection element; the plurality of second terminals include a pluralityof terminals for the coil; the signal processing circuit includes afirst wire having a predetermined length and forming a part of a pathfrom the detection circuit to the second block, and a second wire havinga predetermined length and forming a part of a path from the coil to thesecond block; and a width of the first wire is smaller than a width ofthe second wire.
 17. The magnetic sensor device according to claim 13,wherein: the plurality of second signal terminals and the at least onethird terminal are arranged in a row; the plurality of first signalterminals and the at least one first terminal are arranged in a rowalong the plurality of second signal terminals and the at least onethird terminal; the plurality of fourth terminals are arranged in a row;and the plurality of second terminals are arranged in a row along theplurality of fourth terminals.
 18. The magnetic sensor device accordingto claim 13, wherein: the at least one sensor main body includes a firstsensor main body and a second sensor main body; the at least one firstterminal of the first sensor main body includes one first terminal; theat least one first terminal of the second sensor main body includes twofirst terminals; and the at least one third terminal of the circuit mainbody includes one third terminal.
 19. The magnetic sensor deviceaccording to claim 13, wherein: the at least one sensor main bodyincludes a first sensor main body and a second sensor main body; the atleast one first terminal of the second sensor main body includes twofirst terminals; the at least one third terminal of the circuit mainbody includes one third terminal; and one of the two first terminals andthe one third terminal are electrically connected.
 20. The magneticsensor device according to claim 13, wherein: the at least one sensormain body includes a first sensor main body and a second sensor mainbody; the detection circuit of the first sensor main body is configuredto detect a component of a target magnetic field in a first direction;and the detection circuit of the second sensor main body is configuredto detect a component of the target magnetic field in a second directionand a component of the target magnetic field in a third direction.